10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology MSCM20XM16F4G

Microchip Technology MSCM20XM16F4G electronic component product image

Image is only for reference

Manufacturer No
MSCM20XM16F4G
Availability
In Stock
Package
Module
Packaging
Tube
Description
MOSFET 200V 77A SP4
Detailed Description
Mosfet Array 200V 77A (Tc) Chassis Mount SP4
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tube
Technology
-
FET Feature
-
Manufacturer
Microchip Technology
Mounting Type
Chassis Mount
Package / Case
Module
Base Product Number
MSCM20
Operating Temperature
-
Supplier Device Package
SP4
Drain to Source Voltage (Vdss)
200V
Current - Continuous Drain (Id) @ 25°C
77A (Tc)
AttributeValue
Series-
PackagingTube
Technology-
FET Feature-
ManufacturerMicrochip Technology
Mounting TypeChassis Mount
Package / CaseModule
Base Product NumberMSCM20
Operating Temperature-
Supplier Device PackageSP4
Drain to Source Voltage (Vdss)200V
Current - Continuous Drain (Id) @ 25°C77A (Tc)

Purchase & Inquiry

Placing an Order

You can place an order with FIXCHIPS without having to register or create an account.

Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process