Ultrasonic Scanning Microscope
High-frequency sound waves are used to scan internal chip layers. This process identifies delamination, cracks, and bonding failures invisible to the naked eye or X-ray.
Key Measures
>Internal layer integrity verification
>Detection of trapped air or microcracks
>Non-invasive acoustic analysis
Tools Used:
- Scanning acoustic microscope (SAM)
- Ultrasonic probes
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