X-Ray Inspection
X-ray scanning reveals hidden internal defects such as voids, cracked solder joints, or inconsistencies in BGA packaging. This non-destructive method allows internal verification without damaging the part.
Key Measures
>2D and 3D X-ray imaging
>Solder and internal structure analysis
>Detection of hidden damage or tampering
Tools Used:
- X-ray inspection systems
- BGA analysis software
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