10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Texas Instruments CC2430F32RTC

Texas Instruments CC2430F32RTC electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
CC2430F32RTC
Availability
In Stock
Package
VQFN EP
Packaging
Tray
Description
SOC CC243x 8051 48-Pin VQFN EP Tray
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
HTS
COMPONENTS
I2C
0
I2S
0
PWM
1
SPI
0
USB
0
PPAP
No
Type
System-On-Chip
UART
0
USART
2
EU RoHS
Compliant
Ethernet
0
Mounting
Surface Mount
RAM Size
8KB
ECCN (US)
5A992c.
Packaging
Tray
Pin Count
48
Automotive
No
Lead Shape
No Lead
Device Core
8051
Family Name
CC243x
PCB changed
48
Availability
No Stock Available
Package Width
7
Interface Type
SPI/USART
Package Height
0.9
Package Length
7
Processing Unit
Microcontroller
Programmability
Yes
Supplier Package
VQFN EP
Core Architecture
8051
Program Memory Size
32KB
Program Memory Type
Flash
Standard Package Name
QFN
Manufacturer Lead Time
26 weeks
Number of Watchdog Timers
1
Maximum Clock Frequency (MHz)
32
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
AttributeValue
CAN0
HTSCOMPONENTS
I2C0
I2S0
PWM1
SPI0
USB0
PPAPNo
TypeSystem-On-Chip
UART0
USART2
EU RoHSCompliant
Ethernet0
MountingSurface Mount
RAM Size8KB
ECCN (US)5A992c.
PackagingTray
Pin Count48
AutomotiveNo
Lead ShapeNo Lead
Device Core8051
Family NameCC243x
PCB changed48
AvailabilityNo Stock Available
Package Width7
Interface TypeSPI/USART
Package Height0.9
Package Length7
Processing UnitMicrocontroller
ProgrammabilityYes
Supplier PackageVQFN EP
Core Architecture8051
Program Memory Size32KB
Program Memory TypeFlash
Standard Package NameQFN
Manufacturer Lead Time26 weeks
Number of Watchdog Timers1
Maximum Clock Frequency (MHz)32
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40

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Packaging Process