10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TDK C-STC0G01-E6-KIT

TDK C-STC0G01-E6-KIT electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
C-STC0G01-E6-KIT
Packaging
Book
Description
MID RANGE SOFT TERM MLCC KIT
Detailed Description
Ceramic Capacitor Kit 100pF ~ 0.1µF 100 ~ 1000V (1kV) Surface Mount 140 Pieces (14 Values - 10 Each)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
C
Features
-
Kit Type
Ceramic
Quantity
140 Pieces (14 Values - 10 Each)
Packaging
Book
Tolerance
±5%
Applications
General Purpose
Manufacturer
TDK
Mounting Type
Surface Mount
Voltage - Rated
100 ~ 1000V (1kV)
Capacitance Range
100pF ~ 0.1µF
Packages Included
0402 ~ 1210 (1005 ~ 3528 Metric)
AttributeValue
SeriesC
Features-
Kit TypeCeramic
Quantity140 Pieces (14 Values - 10 Each)
PackagingBook
Tolerance±5%
ApplicationsGeneral Purpose
ManufacturerTDK
Mounting TypeSurface Mount
Voltage - Rated100 ~ 1000V (1kV)
Capacitance Range100pF ~ 0.1µF
Packages Included0402 ~ 1210 (1005 ~ 3528 Metric)

Purchase & Inquiry

Placing an Order

You can place an order with FIXCHIPS without having to register or create an account.

Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process