10-13 NOV 2026 · Munich, Germany

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STMicroelectronics TSC2012HYDT

STMicroelectronics TSC2012HYDT electronic component product image

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Manufacturer
Manufacturer No
TSC2012HYDT
Date Code
20+
Quantity
7,500
Availability
In Stock
Package
8-SOIC (0.154", 3.90mm Width)
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC CURRENT SENSE 1 CIRCUIT 8SOIC
Detailed Description
Current Sense Amplifier 1 Circuit Push-Pull 8-SOIC
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
STMicroelectronics
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Slew Rate
3.9V/µs
Output Type
Push-Pull
Mounting Type
Surface Mount
-3db Bandwidth
750 kHz
Amplifier Type
Current Sense
Package / Case
8-SOIC (0.154", 3.90mm Width)
Current - Supply
1.5mA
Number of Circuits
1
Current - Input Bias
35 µA
Operating Temperature
-40°C ~ 150°C (TA)
Voltage - Input Offset
500 µV
Supplier Device Package
8-SOIC
Voltage - Supply Span (Max)
5.5 V
Voltage - Supply Span (Min)
2.7 V
AttributeValue
MfrSTMicroelectronics
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
Slew Rate3.9V/µs
Output TypePush-Pull
Mounting TypeSurface Mount
-3db Bandwidth750 kHz
Amplifier TypeCurrent Sense
Package / Case8-SOIC (0.154", 3.90mm Width)
Current - Supply1.5mA
Number of Circuits1
Current - Input Bias35 µA
Operating Temperature-40°C ~ 150°C (TA)
Voltage - Input Offset500 µV
Supplier Device Package8-SOIC
Voltage - Supply Span (Max)5.5 V
Voltage - Supply Span (Min)2.7 V

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Packaging Process