Silicon Motion, Inc. SM662PEC-BD
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.32.00.71 |
| PPAP | Unknown |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| Cell Type | NAND |
| ECCN (US) | EAR99 |
| Packaging | Tray |
| Pin Count | 153 |
| Automotive | Yes |
| Boot Block | No |
| ECC Support | Yes |
| PCB changed | 153 |
| Timing Type | Synchronous |
| Availability | No Stock Available |
| Package Width | 14 |
| Interface Type | Serial e-MMC |
| Package Height | 1.4 |
| Package Length | 18 |
| Programmability | Yes |
| Supplier Package | BGA |
| Chip Density (bit) | 512G |
| Command Compatible | Yes |
| Support of Page Mode | No |
| Standard Package Name | BGA |
| Supplier Temperature Grade | Industrial |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
Purchase & Inquiry
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Packaging Process
