10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Silicon Motion, Inc. SM662PE8-AB

Silicon Motion, Inc. SM662PE8-AB electronic component product image

Image is only for reference

Manufacturer No
SM662PE8-AB
Package
BGA
Description
eMMC 5.0 8GB MLC 153 ball
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.32.00.71
PPAP
Unknown
EU RoHS
Compliant
Mounting
Surface Mount
Cell Type
NAND
Pin Count
100
Automotive
Yes
Lead Shape
Ball
PCB changed
100
Availability
No Stock Available
Package Width
14
Package Height
1.4
Package Length
18
Supplier Package
BGA
Chip Density (bit)
8G
Standard Package Name
BGA
Supplier Temperature Grade
Industrial
AttributeValue
HTS8542.32.00.71
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
Cell TypeNAND
Pin Count100
AutomotiveYes
Lead ShapeBall
PCB changed100
AvailabilityNo Stock Available
Package Width14
Package Height1.4
Package Length18
Supplier PackageBGA
Chip Density (bit)8G
Standard Package NameBGA
Supplier Temperature GradeIndustrial

Purchase & Inquiry

Placing an Order

You can place an order with FIXCHIPS without having to register or create an account.

Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process