10-13 NOV 2026 · Munich, Germany

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Silicon Labs TS12012ITD1022T

Silicon Labs TS12012ITD1022T electronic component product image

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Manufacturer
Manufacturer No
TS12012ITD1022T
Availability
In Stock
Package
10-UFDFN Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC OPAMP GP 1 CIRCUIT 10TDFN
Detailed Description
Standard (General Purpose) Amplifier 1 Circuit Open Drain 10-TDFN (2x2)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Silicon Labs
Series
-
Packaging
Tape & Reel (TR)
Slew Rate
0.006V/µs
Output Type
Open Drain
Mounting Type
Surface Mount
Amplifier Type
Standard (General Purpose)
Package / Case
10-UFDFN Exposed Pad
Current - Supply
1.1µA
Number of Circuits
1
Current - Input Bias
20 nA
Operating Temperature
-40°C ~ 85°C
Gain Bandwidth Product
15 kHz
Voltage - Input Offset
3.5 mV
Supplier Device Package
10-TDFN (2x2)
Current - Output / Channel
1.4 mA
Voltage - Supply Span (Max)
2.5 V
Voltage - Supply Span (Min)
0.8 V
AttributeValue
MfrSilicon Labs
Series-
PackagingTape & Reel (TR)
Slew Rate0.006V/µs
Output TypeOpen Drain
Mounting TypeSurface Mount
Amplifier TypeStandard (General Purpose)
Package / Case10-UFDFN Exposed Pad
Current - Supply1.1µA
Number of Circuits1
Current - Input Bias20 nA
Operating Temperature-40°C ~ 85°C
Gain Bandwidth Product15 kHz
Voltage - Input Offset3.5 mV
Supplier Device Package10-TDFN (2x2)
Current - Output / Channel1.4 mA
Voltage - Supply Span (Max)2.5 V
Voltage - Supply Span (Min)0.8 V

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Packaging Process