10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Same Sky (Formerly CUI Devices) HSS20-B20-NP

Same Sky (Formerly CUI Devices) HSS20-B20-NP electronic component product image

Image is only for reference

Manufacturer No
HSS20-B20-NP
Packaging
Bag
Description
HEAT SINK, STAMPING, TO-218/TO-2
Detailed Description
Heat Sink TO-218, TO-220 Aluminum Alloy 2.84W @ 75°C Top Mount
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Same Sky (Formerly CUI Devices)
Type
Top Mount
Shape
Rectangular, Fins
Width
0.748" (19.00mm)
Length
0.866" (22.00mm)
Series
HSS
Diameter
-
Material
Aluminum Alloy
Packaging
Bag
Fin Height
0.433" (11.00mm)
Package Cooled
TO-218, TO-220
Material Finish
Black Anodized
Attachment Method
Bolt On
Thermal Resistance @ Natural
26.40°C/W
Power Dissipation @ Temperature Rise
2.84W @ 75°C
Thermal Resistance @ Forced Air Flow
11.20°C/W @ 200 LFM
AttributeValue
MfrSame Sky (Formerly CUI Devices)
TypeTop Mount
ShapeRectangular, Fins
Width0.748" (19.00mm)
Length0.866" (22.00mm)
SeriesHSS
Diameter-
MaterialAluminum Alloy
PackagingBag
Fin Height0.433" (11.00mm)
Package CooledTO-218, TO-220
Material FinishBlack Anodized
Attachment MethodBolt On
Thermal Resistance @ Natural26.40°C/W
Power Dissipation @ Temperature Rise2.84W @ 75°C
Thermal Resistance @ Forced Air Flow11.20°C/W @ 200 LFM

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process