10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Pulse Electronics PG1083.472NLT

Pulse Electronics PG1083.472NLT electronic component product image

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Manufacturer
Manufacturer No
PG1083.472NLT
Availability
In Stock
Packaging
Tape and Reel
Description
Inductor Power Shielded Wirewound 4.7uH/4.1uH 20% 100KHz Ferrite 26A 0.0028Ohm DCR T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8504.50.40.00
PPAP
No
Type
Power
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Tolerance
20%
Automotive
No
Technology
Wirewound
Availability
No Stock Available
Core Material
Ferrite
Inductance (H)
4.7u(OCL)/4.1u
Protection Style
Shielded
Number of Terminals
3
Manufacturer Lead Time
12 weeks
Maximum DC Current (A)
26
Maximum Product Depth (mm)
21.5
Maximum DC Resistance (Ohm)
0.0028
Maximum Product Height (mm)
12.5
Maximum Product Length (mm)
21.7
Inductance Test Frequency (Hz)
100K
Maximum Saturation Current (A)
30
Maximum Operating Temperature (°C)
130
Minimum Operating Temperature (°C)
-40
AttributeValue
HTS8504.50.40.00
PPAPNo
TypePower
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Tolerance20%
AutomotiveNo
TechnologyWirewound
AvailabilityNo Stock Available
Core MaterialFerrite
Inductance (H)4.7u(OCL)/4.1u
Protection StyleShielded
Number of Terminals3
Manufacturer Lead Time12 weeks
Maximum DC Current (A)26
Maximum Product Depth (mm)21.5
Maximum DC Resistance (Ohm)0.0028
Maximum Product Height (mm)12.5
Maximum Product Length (mm)21.7
Inductance Test Frequency (Hz)100K
Maximum Saturation Current (A)30
Maximum Operating Temperature (°C)130
Minimum Operating Temperature (°C)-40

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process