10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi NTSB60100CTT4G

onsemi NTSB60100CTT4G electronic component product image

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Manufacturer
Manufacturer No
NTSB60100CTT4G
Package
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging
Bulk
Description
DIODE ARRAY SCHOT 100V 60A D2PAK
Detailed Description
Diode Array 1 Pair Common Cathode 100 V 60A Surface Mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
-
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Bulk
Technology
Schottky
Manufacturer
onsemi
Mounting Type
Surface Mount
Qualification
-
Package / Case
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Diode Configuration
1 Pair Common Cathode
Supplier Device Package
D2PAK
Current - Reverse Leakage @ Vr
1 mA @ 100 V
Voltage - DC Reverse (Vr) (Max)
100 V
Operating Temperature - Junction
-40°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If
840 mV @ 30 A
Current - Average Rectified (Io) (per Diode)
60A
AttributeValue
Grade-
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingBulk
TechnologySchottky
Manufactureronsemi
Mounting TypeSurface Mount
Qualification-
Package / CaseTO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Diode Configuration1 Pair Common Cathode
Supplier Device PackageD2PAK
Current - Reverse Leakage @ Vr1 mA @ 100 V
Voltage - DC Reverse (Vr) (Max)100 V
Operating Temperature - Junction-40°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If840 mV @ 30 A
Current - Average Rectified (Io) (per Diode)60A

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Packaging Process