10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi LA7791T-TLM-E

onsemi LA7791T-TLM-E electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
LA7791T-TLM-E
Package
20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC VARIABLE GAIN 1 CIRC 20TSSOPJ
Detailed Description
Variable Gain Amplifier 1 Circuit Differential 20-TSSOPJ
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
onsemi
Series
-
Packaging
Tape & Reel (TR)
Slew Rate
-
Output Type
Differential
Mounting Type
Surface Mount
Amplifier Type
Variable Gain
Package / Case
20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Current - Supply
180mA
Number of Circuits
1
Base Product Number
LA7791
Operating Temperature
-20°C ~ 75°C
Supplier Device Package
20-TSSOPJ
Voltage - Supply Span (Max)
5.25 V
Voltage - Supply Span (Min)
4.75 V
AttributeValue
Mfronsemi
Series-
PackagingTape & Reel (TR)
Slew Rate-
Output TypeDifferential
Mounting TypeSurface Mount
Amplifier TypeVariable Gain
Package / Case20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Current - Supply180mA
Number of Circuits1
Base Product NumberLA7791
Operating Temperature-20°C ~ 75°C
Supplier Device Package20-TSSOPJ
Voltage - Supply Span (Max)5.25 V
Voltage - Supply Span (Min)4.75 V

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process