NXP USA Inc. PCF8591P,112

NXP USA Inc. PCF8591P,112 electronic component product image

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Manufacturer
Manufacturer No
PCF8591P,112
Package
16-DIP (0.300", 7.62mm)
Packaging
Bulk
Description
IC DAS/ADC/DAC SPECIAL 16-DIP
Detailed Description
ADC, DAC 8 b 11.1k I2C, Serial 16-DIP
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
ADC, DAC
Series
-
Packaging
Bulk
Manufacturer
NXP USA Inc.
Mounting Type
Through Hole
Data Interface
I2C, Serial
Package / Case
16-DIP (0.300", 7.62mm)
Voltage - Supply
2.5V ~ 6V
Resolution (Bits)
8 b
Number of Channels
4
Base Product Number
PCF85
Operating Temperature
-40°C ~ 85°C
Voltage Supply Source
Single Supply
Supplier Device Package
16-DIP
Sampling Rate (Per Second)
11.1k
AttributeValue
TypeADC, DAC
Series-
PackagingBulk
ManufacturerNXP USA Inc.
Mounting TypeThrough Hole
Data InterfaceI2C, Serial
Package / Case16-DIP (0.300", 7.62mm)
Voltage - Supply2.5V ~ 6V
Resolution (Bits)8 b
Number of Channels4
Base Product NumberPCF85
Operating Temperature-40°C ~ 85°C
Voltage Supply SourceSingle Supply
Supplier Device Package16-DIP
Sampling Rate (Per Second)11.1k

Purchase & Inquiry

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping