10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NextGen Components MDD3400A

NextGen Components MDD3400A electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MDD3400A
Package
TO-236-3, SC-59, SOT-23-3
Packaging
Tape & Reel (TR)
Description
MOSFET N-CH 30V 5.8A SOT23
Detailed Description
N-Channel 30 V 5.8A 1.5W (Ta) Surface Mount SOT-23
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NextGen Components
Series
MDD
FET Type
N-Channel
Packaging
Tape & Reel (TR)
Vgs (Max)
±12V
Technology
MOSFET (Metal Oxide)
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Vgs(th) (Max) @ Id
1.2V @ 250µA
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
32mOhm @ 5.8A, 10V
Power Dissipation (Max)
1.5W (Ta)
Supplier Device Package
SOT-23
Gate Charge (Qg) (Max) @ Vgs
10.5 nC @ 4.5 V
Drain to Source Voltage (Vdss)
30 V
Input Capacitance (Ciss) (Max) @ Vds
635 pF @ 15 V
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Current - Continuous Drain (Id) @ 25°C
5.8A
AttributeValue
MfrNextGen Components
SeriesMDD
FET TypeN-Channel
PackagingTape & Reel (TR)
Vgs (Max)±12V
TechnologyMOSFET (Metal Oxide)
Mounting TypeSurface Mount
Package / CaseTO-236-3, SC-59, SOT-23-3
Vgs(th) (Max) @ Id1.2V @ 250µA
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs32mOhm @ 5.8A, 10V
Power Dissipation (Max)1.5W (Ta)
Supplier Device PackageSOT-23
Gate Charge (Qg) (Max) @ Vgs10.5 nC @ 4.5 V
Drain to Source Voltage (Vdss)30 V
Input Capacitance (Ciss) (Max) @ Vds635 pF @ 15 V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Current - Continuous Drain (Id) @ 25°C5.8A

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Packaging Process