10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NextGen Components BSS123

NextGen Components BSS123 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
BSS123
Date Code
22+
Quantity
22,100
Availability
In Stock
Package
TO-236-3, SC-59, SOT-23-3
Packaging
Tape & Reel (TR)
Description
MOSFET N-CH 100V 0.2A SOT23
Detailed Description
N-Channel 100 V 200mA 350mW (Ta) Surface Mount SOT-23
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NextGen Components
Series
BSS
FET Type
N-Channel
Packaging
Tape & Reel (TR)
Vgs (Max)
±20V
Technology
MOSFET (Metal Oxide)
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Vgs(th) (Max) @ Id
2.5V @ 250µA
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
5Ohm @ 200mA, 10V
Power Dissipation (Max)
350mW (Ta)
Supplier Device Package
SOT-23
Gate Charge (Qg) (Max) @ Vgs
1.61 nC @ 10 V
Drain to Source Voltage (Vdss)
100 V
Input Capacitance (Ciss) (Max) @ Vds
32 pF @ 50 V
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Current - Continuous Drain (Id) @ 25°C
200mA
AttributeValue
MfrNextGen Components
SeriesBSS
FET TypeN-Channel
PackagingTape & Reel (TR)
Vgs (Max)±20V
TechnologyMOSFET (Metal Oxide)
Mounting TypeSurface Mount
Package / CaseTO-236-3, SC-59, SOT-23-3
Vgs(th) (Max) @ Id2.5V @ 250µA
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs5Ohm @ 200mA, 10V
Power Dissipation (Max)350mW (Ta)
Supplier Device PackageSOT-23
Gate Charge (Qg) (Max) @ Vgs1.61 nC @ 10 V
Drain to Source Voltage (Vdss)100 V
Input Capacitance (Ciss) (Max) @ Vds32 pF @ 50 V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Current - Continuous Drain (Id) @ 25°C200mA

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Packaging Process