10-13 NOV 2026 · Munich, Germany

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MicroStrain by HBK 6305-6002

MicroStrain by HBK 6305-6002 electronic component product image

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Manufacturer
Manufacturer No
6305-6002
Package
Module
Packaging
Bulk
Description
G-Link-200-OEM-8G
Detailed Description
Accelerometer X, Y, Z Axis ±2g, 4g, 8g 1kHz Module
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Axis
X, Y, Z
Type
Digital
Grade
-
Series
G-Link-200-OEM-8G
Features
High/Low Pass Filter, Selectable Scale, Sleep Mode, Standby Mode
Bandwidth
1kHz
Packaging
Bulk
Output Type
WIFI
Manufacturer
MicroStrain by HBK
Mounting Type
Chassis Mount
Qualification
-
Package / Case
Module
Voltage - Supply
5VDC
Acceleration Range
±2g, 4g, 8g
Sensitivity (mV/g)
-
Sensitivity (LSB/g)
65536 (±8g)
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
Module
AttributeValue
AxisX, Y, Z
TypeDigital
Grade-
SeriesG-Link-200-OEM-8G
FeaturesHigh/Low Pass Filter, Selectable Scale, Sleep Mode, Standby Mode
Bandwidth1kHz
PackagingBulk
Output TypeWIFI
ManufacturerMicroStrain by HBK
Mounting TypeChassis Mount
Qualification-
Package / CaseModule
Voltage - Supply5VDC
Acceleration Range±2g, 4g, 8g
Sensitivity (mV/g)-
Sensitivity (LSB/g)65536 (±8g)
Operating Temperature-40°C ~ 85°C
Supplier Device PackageModule

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Packaging Process