10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology SCH3223I-7U

Microchip Technology SCH3223I-7U electronic component product image

Image is only for reference

Manufacturer No
SCH3223I-7U
Availability
In Stock
Package
WFBGA
Packaging
Tray
Description
Programmable Wake up Event Interface 64-Pin WFBGA Tray
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.39.00.90
PPAP
No
EU RoHS
Compliant
Category
Programmable Wake up Event Interface
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tray
Pin Count
64
Automotive
No
Lead Shape
Ball
PCB changed
64
Availability
No Stock Available
Package Width
6
Interface Type
Serial
Package Height
0.8(Max) - 0.17
Package Length
6
Supplier Package
WFBGA
Standard Package Name
BGA
Supplier Temperature Grade
Industrial
Maximum Supply Current (mA)
1
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
2.97
Typical Operating Supply Voltage (V)
3.3
AttributeValue
HTS8542.39.00.90
PPAPNo
EU RoHSCompliant
CategoryProgrammable Wake up Event Interface
MountingSurface Mount
ECCN (US)EAR99
PackagingTray
Pin Count64
AutomotiveNo
Lead ShapeBall
PCB changed64
AvailabilityNo Stock Available
Package Width6
Interface TypeSerial
Package Height0.8(Max) - 0.17
Package Length6
Supplier PackageWFBGA
Standard Package NameBGA
Supplier Temperature GradeIndustrial
Maximum Supply Current (mA)1
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.97
Typical Operating Supply Voltage (V)3.3

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process