10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology LAN9215I-MT

Microchip Technology LAN9215I-MT electronic component product image

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Manufacturer No
LAN9215I-MT
Date Code
25+
Quantity
1,600
Availability
In Stock
Package
TQFP
Packaging
Tray
Description
Ethernet CTLR Single Chip 10Mbps/100Mbps 3.3V 100-Pin TQFP Tray
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
COMPONENTS
PPAP
No
EU RoHS
Compliant
Category
Single Chip
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tray
Pin Count
100
Automotive
No
Lead Shape
Gull-wing
DMA Support
Yes
PCB changed
100
Availability
No Stock Available
Package Width
14
Package Height
1.4
Package Length
14
Auto-Negotiation
Yes
Supplier Package
TQFP
Communication Mode
Full Duplex|Half Duplex
Standard Supported
IEEE 802.3|IEEE 802.3u
Ethernet Speed (Mbps)
10|100
Physical Network Type
100BASE-TX|10BASE-T
Standard Package Name
QFP
Manufacturer Lead Time
5 weeks
Ethernet Interface Type
MII
Supplier Temperature Grade
Industrial
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Typical Operating Supply Voltage (V)
3.3
AttributeValue
HTSCOMPONENTS
PPAPNo
EU RoHSCompliant
CategorySingle Chip
MountingSurface Mount
ECCN (US)EAR99
PackagingTray
Pin Count100
AutomotiveNo
Lead ShapeGull-wing
DMA SupportYes
PCB changed100
AvailabilityNo Stock Available
Package Width14
Package Height1.4
Package Length14
Auto-NegotiationYes
Supplier PackageTQFP
Communication ModeFull Duplex|Half Duplex
Standard SupportedIEEE 802.3|IEEE 802.3u
Ethernet Speed (Mbps)10|100
Physical Network Type100BASE-TX|10BASE-T
Standard Package NameQFP
Manufacturer Lead Time5 weeks
Ethernet Interface TypeMII
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Typical Operating Supply Voltage (V)3.3

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Packaging Process