10-13 NOV 2026 · Munich, Germany

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Microchip Technology 1N5802US

Microchip Technology 1N5802US electronic component product image

Image is only for reference

Manufacturer No
1N5802US
Availability
In Stock
Package
SQ-MELF, A
Packaging
Bulk
Description
DIODE STANDARD 50V 1A D5A
Detailed Description
Diode 50 V 1A Surface Mount D-5A
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Microchip Technology
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Bulk
Technology
Standard
Mounting Type
Surface Mount
Package / Case
SQ-MELF, A
Base Product Number
1N5802
Capacitance @ Vr, F
25pF @ 10V, 1MHz
Supplier Device Package
D-5A
Reverse Recovery Time (trr)
25 ns
Current - Reverse Leakage @ Vr
1 µA @ 50 V
Voltage - DC Reverse (Vr) (Max)
50 V
Current - Average Rectified (Io)
1A
Operating Temperature - Junction
-65°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
875 mV @ 1 A
AttributeValue
MfrMicrochip Technology
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingBulk
TechnologyStandard
Mounting TypeSurface Mount
Package / CaseSQ-MELF, A
Base Product Number1N5802
Capacitance @ Vr, F25pF @ 10V, 1MHz
Supplier Device PackageD-5A
Reverse Recovery Time (trr)25 ns
Current - Reverse Leakage @ Vr1 µA @ 50 V
Voltage - DC Reverse (Vr) (Max)50 V
Current - Average Rectified (Io)1A
Operating Temperature - Junction-65°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If875 mV @ 1 A

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Packaging Process