10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Micro Commercial Components MCM2301-TP

Micro Commercial Components MCM2301-TP electronic component product image

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Manufacturer No
MCM2301-TP
Date Code
25+
Quantity
30,000
Availability
In Stock
Package
DFN EP
Packaging
Tape and Reel
Description
Trans MOSFET P-CH 20V 3.8A 6-Pin DFN EP T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.29.00.55
PPAP
Yes
SVHC
Yes
EU RoHS
Compliant
Category
Power MOSFET
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
6
Automotive
Yes
PCB changed
6
Availability
In Stock
Channel Mode
Enhancement
Channel Type
P
Configuration
Dual
Package Width
2.05(Max)
Package Height
0.8(Max)
Package Length
2.05(Max)
Supplier Package
DFN EP
Maximum IDSS (uA)
1
Standard Package Name
DFN
Manufacturer Lead Time
20 weeks
Typical Fall Time (ns)
21
Typical Rise Time (ns)
8
Number of Elements per Chip
2
Maximum Power Dissipation (mW)
1400
Typical Gate Charge @ Vgs (nC)
Maximum Gate-Source Voltage (V)
±10
Typical Turn-On Delay Time (ns)
8
Maximum Drain-Source Voltage (V)
20
Typical Turn-Off Delay Time (ns)
54
Maximum Gate Threshold Voltage (V)
0.9
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Maximum Continuous Drain Current (A)
3.8
Typical Input Capacitance @ Vds (pF)
492@6V
Maximum Drain-Source Resistance (mOhm)
Maximum Gate-Source Leakage Current (nA)
100
AttributeValue
HTS8541.29.00.55
PPAPYes
SVHCYes
EU RoHSCompliant
CategoryPower MOSFET
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count6
AutomotiveYes
PCB changed6
AvailabilityIn Stock
Channel ModeEnhancement
Channel TypeP
ConfigurationDual
Package Width2.05(Max)
Package Height0.8(Max)
Package Length2.05(Max)
Supplier PackageDFN EP
Maximum IDSS (uA)1
Standard Package NameDFN
Manufacturer Lead Time20 weeks
Typical Fall Time (ns)21
Typical Rise Time (ns)8
Number of Elements per Chip2
Maximum Power Dissipation (mW)1400
Typical Gate Charge @ Vgs (nC)[email protected]
Maximum Gate-Source Voltage (V)±10
Typical Turn-On Delay Time (ns)8
Maximum Drain-Source Voltage (V)20
Typical Turn-Off Delay Time (ns)54
Maximum Gate Threshold Voltage (V)0.9
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)3.8
Typical Input Capacitance @ Vds (pF)492@6V
Maximum Drain-Source Resistance (mOhm)[email protected]
Maximum Gate-Source Leakage Current (nA)100

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Packaging Process