10-13 NOV 2026 · Munich, Germany

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Laird Technologies EMI BMI-C-006

Laird Technologies EMI BMI-C-006 electronic component product image

Image is only for reference

Manufacturer No
BMI-C-006
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
RFI FINGERSTOCK BECU TIN SOLDER
Detailed Description
RFI Fingerstock Beryllium Copper Tin Solder
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
Fingerstock
Shape
-
Width
0.079" (2.00mm)
Height
0.100" (2.54mm)
Length
0.113" (2.86mm)
Series
BMI-C
Plating
Tin
Material
Beryllium Copper
Packaging
Tape & Reel (TR); Cut Tape (CT)
Shelf Life
12 Months
Manufacturer
Laird Technologies EMI
Shelf Life Start
-
Attachment Method
Solder
Plating - Thickness
-
Operating Temperature
-
Storage/Refrigeration Temperature
50°F ~ 77°F (10°C ~ 25°C)
AttributeValue
TypeFingerstock
Shape-
Width0.079" (2.00mm)
Height0.100" (2.54mm)
Length0.113" (2.86mm)
SeriesBMI-C
PlatingTin
MaterialBeryllium Copper
PackagingTape & Reel (TR); Cut Tape (CT)
Shelf Life12 Months
ManufacturerLaird Technologies EMI
Shelf Life Start-
Attachment MethodSolder
Plating - Thickness-
Operating Temperature-
Storage/Refrigeration Temperature50°F ~ 77°F (10°C ~ 25°C)

Purchase & Inquiry

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RFQ (Request for Quote)

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Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process