10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Kingston Technology B3221XM3BDGVI-U

Kingston Technology B3221XM3BDGVI-U electronic component product image

Image is only for reference

Manufacturer No
B3221XM3BDGVI-U
Quantity
5
Availability
In Stock
Package
200-WFBGA
Packaging
Tray
Description
IC DRAM 32GBIT PAR 200FBGA
Detailed Description
SDRAM - Mobile LPDDR4X Memory IC 32Gbit Parallel 2.133 GHz 3.5 ns 200-FBGA (10x14.5)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Kingston Technology
Grade
-
Series
LPDDR4X
Packaging
Tray
Technology
SDRAM - Mobile LPDDR4X
Access Time
3.5 ns
Memory Size
32Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Qualification
-
Package / Case
200-WFBGA
Clock Frequency
2.133 GHz
Memory Interface
Parallel
Voltage - Supply
1.06V ~ 1.17V, 1.7V ~ 1.95V
Base Product Number
B3221XM3
Memory Organization
2G x 16
Operating Temperature
-25°C ~ 85°C (TC)
Supplier Device Package
200-FBGA (10x14.5)
Write Cycle Time - Word, Page
18ns
AttributeValue
MfrKingston Technology
Grade-
SeriesLPDDR4X
PackagingTray
TechnologySDRAM - Mobile LPDDR4X
Access Time3.5 ns
Memory Size32Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
Qualification-
Package / Case200-WFBGA
Clock Frequency2.133 GHz
Memory InterfaceParallel
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
Base Product NumberB3221XM3
Memory Organization2G x 16
Operating Temperature-25°C ~ 85°C (TC)
Supplier Device Package200-FBGA (10x14.5)
Write Cycle Time - Word, Page18ns

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Packaging Process