Infineon Technologies XMC7200D-E272K8384AAES
Image is only for reference
| Attribute | Value |
|---|---|
| CAN | 10 |
| I2C | 11 |
| I2S | 0 |
| SPI | 11 |
| USB | 0 |
| PPAP | No |
| UART | 11 |
| USART | 0 |
| EU RoHS | Compliant |
| Ethernet | 2 |
| Mounting | Surface Mount |
| RAM Size | 1MB |
| ECCN (US) | 5A992.c |
| Packaging | Tray |
| Pin Count | 272 |
| Automotive | No |
| Lead Shape | Ball |
| Device Core | ARM Cortex M0+|ARM Cortex M7 |
| Family Name | XMC7000 |
| PCB changed | 272 |
| ADC Channels | 96 |
| Availability | No Stock Available |
| No. of Timers | 3 |
| Package Width | 16 |
| Interface Type | CAN/Ethernet/I2C/SPI/UART |
| Number of ADCs | 1 |
| Number of I/Os | 187 |
| Package Height | 1.3(Max) |
| Package Length | 16 |
| Programmability | Yes |
| Supplier Package | FBGA |
| Core Architecture | ARM |
| Program Memory Size | 8640KB |
| Program Memory Type | Flash |
| ADC Resolution (bit) | 12 |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Maximum CPU Frequency (MHz) | 100|350 |
| Instruction Set Architecture | RISC |
| Maximum Clock Frequency (MHz) | 100|350 |
| Maximum Power Dissipation (mW) | 2000 |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 1.15|5.5 |
| Minimum Operating Supply Voltage (V) | 1.05|2.7 |
| Typical Operating Supply Voltage (V) | 1.1|3.3|5 |
Purchase & Inquiry
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Packaging Process
