Everspin Technologies Inc. MR2A16ACMA35
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.32.00.41 |
| PPAP | No |
| SVHC | Yes |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tray |
| Pin Count | 48 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 48 |
| Availability | No Stock Available |
| Organization | 256Kx16 |
| Package Width | 8 |
| Interface Type | Parallel |
| Package Height | 1.02 |
| Package Length | 8 |
| Supplier Package | FBGA |
| Chip Density (bit) | 4M |
| Process Technology | 180nm |
| Density Range (bit) | 256K to 8M |
| Data Bus Width (bit) | 16 |
| Max. Access Time (ns) | 35 |
| Standard Package Name | BGA |
| Manufacturer Lead Time | 26 weeks |
| Operating Current (mA) | 165 |
| SVHC Exceeds Threshold | Yes |
| Supplier Temperature Grade | Industrial |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
Purchase & Inquiry
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We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
