10-13 NOV 2026 · Munich, Germany

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Diotec Semiconductor LL103BR13

Diotec Semiconductor LL103BR13 electronic component product image

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Manufacturer No
LL103BR13
Package
DO-213AC, MINI-MELF, SOD-80
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
DIODE SCHOTTKY 30V 350MA SOD80C
Detailed Description
Diode 30 V 350mA Surface Mount SOD-80C
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Diotec Semiconductor
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
Schottky
Mounting Type
Surface Mount
Package / Case
DO-213AC, MINI-MELF, SOD-80
Capacitance @ Vr, F
50pF @ 0V, 1MHz
Supplier Device Package
SOD-80C
Reverse Recovery Time (trr)
10 ns
Current - Reverse Leakage @ Vr
5 µA @ 20 V
Voltage - DC Reverse (Vr) (Max)
30 V
Current - Average Rectified (Io)
350mA
Operating Temperature - Junction
-55°C ~ 125°C
Voltage - Forward (Vf) (Max) @ If
600 mV @ 200 mA
AttributeValue
MfrDiotec Semiconductor
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologySchottky
Mounting TypeSurface Mount
Package / CaseDO-213AC, MINI-MELF, SOD-80
Capacitance @ Vr, F50pF @ 0V, 1MHz
Supplier Device PackageSOD-80C
Reverse Recovery Time (trr)10 ns
Current - Reverse Leakage @ Vr5 µA @ 20 V
Voltage - DC Reverse (Vr) (Max)30 V
Current - Average Rectified (Io)350mA
Operating Temperature - Junction-55°C ~ 125°C
Voltage - Forward (Vf) (Max) @ If600 mV @ 200 mA

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Packaging Process