10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Delevan S0402-47NF1U

Delevan S0402-47NF1U electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
S0402-47NF1U
Description
Inductor RF Chip Wirewound 0.047uH 1% 250MHz 19Q-Factor Alumina 0.15A 0.83Ohm DCR 0402
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
EA
PPAP
No
Type
RF Chip
EU RoHS
Compliant
Mounting
Surface Mount
Case Size
0402
ECCN (US)
EAR99
Tolerance
1%
Automotive
No
Technology
Wirewound
Availability
No Stock Available
Core Material
Alumina
Inductance (H)
0.047u
Number of Terminals
2
Maximum DC Current (A)
0.15
Minimum Quality Factor
19
Maximum Product Depth (mm)
0.64
Maximum DC Resistance (Ohm)
0.83
Maximum Product Height (mm)
0.76
Maximum Product Length (mm)
1.09
Quality Test Frequency (Hz)
250M
Inductance Test Frequency (Hz)
250M
Maximum Operating Temperature (°C)
125
Minimum Operating Temperature (°C)
-55
Minimum Self Resonant Frequency (Hz)
2100M
AttributeValue
HTSEA
PPAPNo
TypeRF Chip
EU RoHSCompliant
MountingSurface Mount
Case Size0402
ECCN (US)EAR99
Tolerance1%
AutomotiveNo
TechnologyWirewound
AvailabilityNo Stock Available
Core MaterialAlumina
Inductance (H)0.047u
Number of Terminals2
Maximum DC Current (A)0.15
Minimum Quality Factor19
Maximum Product Depth (mm)0.64
Maximum DC Resistance (Ohm)0.83
Maximum Product Height (mm)0.76
Maximum Product Length (mm)1.09
Quality Test Frequency (Hz)250M
Inductance Test Frequency (Hz)250M
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-55
Minimum Self Resonant Frequency (Hz)2100M

Purchase & Inquiry

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RFQ (Request for Quote)

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process