10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Central Technologies CTHC2220F-180K

Central Technologies CTHC2220F-180K electronic component product image

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Manufacturer No
CTHC2220F-180K
Package
2220 (5750 Metric)
Packaging
Tape & Reel (TR)
Description
FIXED IND 18UH 530MA 360 MOHM
Detailed Description
18 µH Shielded Drum Core, Wirewound Inductor 530 mA 360mOhm Max 2220 (5750 Metric)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Central Technologies
Type
Drum Core, Wirewound
Series
CTHC2220F
Ratings
-
Features
-
Q @ Freq
10 @ 2.52MHz
Packaging
Tape & Reel (TR)
Shielding
Shielded
Tolerance
±10%
Inductance
18 µH
Mounting Type
Surface Mount
Package / Case
2220 (5750 Metric)
Material - Core
Ferrite
Size / Dimension
0.220" L x 0.197" W (5.60mm x 5.00mm)
DC Resistance (DCR)
360mOhm Max
Current Rating (Amps)
530 mA
Height - Seated (Max)
0.169" (4.30mm)
Operating Temperature
-25°C ~ 85°C
Supplier Device Package
2220
Frequency - Self Resonant
14MHz
Current - Saturation (Isat)
-
Inductance Frequency - Test
2.52 MHz
AttributeValue
MfrCentral Technologies
TypeDrum Core, Wirewound
SeriesCTHC2220F
Ratings-
Features-
Q @ Freq10 @ 2.52MHz
PackagingTape & Reel (TR)
ShieldingShielded
Tolerance±10%
Inductance18 µH
Mounting TypeSurface Mount
Package / Case2220 (5750 Metric)
Material - CoreFerrite
Size / Dimension0.220" L x 0.197" W (5.60mm x 5.00mm)
DC Resistance (DCR)360mOhm Max
Current Rating (Amps)530 mA
Height - Seated (Max)0.169" (4.30mm)
Operating Temperature-25°C ~ 85°C
Supplier Device Package2220
Frequency - Self Resonant14MHz
Current - Saturation (Isat)-
Inductance Frequency - Test2.52 MHz

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process