ATP Electronics, Inc. AT16L64A6SQC4M
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| Attribute | Value |
|---|---|
| HTS | 8473.30.11.40 |
| PLL | No |
| PPAP | No |
| Module | DRAM |
| EU RoHS | Compliant |
| Mounting | Socket |
| ECCN (US) | EAR99 |
| Pin Count | 200 |
| Automotive | No |
| CAS Latency | 3 |
| ECC Support | No |
| Module Type | 200SODIMM |
| PCB changed | 200 |
| Subcategory | DDR SDRAM |
| Availability | No Stock Available |
| Module Sides | Single |
| Organization | 16Mx64 |
| Self Refresh | Yes |
| Package Width | 2.46(Max) |
| Module Density | 128Mbyte |
| Package Height | 31.75 |
| Package Length | 67.56 |
| Refresh Cycles | 8K |
| Number of Ranks | Single |
| Supplier Package | USODIMM |
| Chip Package Type | TSOP-II |
| Chip Configuration | 16Mx16 |
| Chip Density (bit) | 256M |
| SPD EEPROM Support | Yes |
| Data Bus Width (bit) | 64 |
| Max. Access Time (ns) | 0.65 |
| Manufacturer Lead Time | 40 weeks |
| Operating Current (mA) | 1040 |
| Maximum Clock Rate (MHz) | 200 |
| Number of Memory Chips per Module | 4 |
| Maximum Operating Temperature (°C) | 70 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 2.7 |
| Minimum Operating Supply Voltage (V) | 2.3 |
| Typical Operating Supply Voltage (V) | 2.5 |
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Packaging Process
