10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

AMD XC3S2000-4FG676I

AMD XC3S2000-4FG676I electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
XC3S2000-4FG676I
Date Code
24+
Quantity
3,966
Availability
In Stock
Package
676-BGA
Packaging
Bulk
Description
IC FPGA 489 I/O 676FCBGA
Detailed Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 489 737280 46080 676-BGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Spartan®-3
Packaging
Bulk
Mounting Type
Surface Mount
Number of I/O
489
Package / Case
676-BGA
Total RAM Bits
737280
Number of Gates
2000000
Voltage - Supply
1.14V ~ 1.26V
Base Product Number
XC3S2000
Number of LABs/CLBs
5120
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
676-FBGA (27x27)
Number of Logic Elements/Cells
46080
AttributeValue
MfrAMD
SeriesSpartan®-3
PackagingBulk
Mounting TypeSurface Mount
Number of I/O489
Package / Case676-BGA
Total RAM Bits737280
Number of Gates2000000
Voltage - Supply1.14V ~ 1.26V
Base Product NumberXC3S2000
Number of LABs/CLBs5120
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package676-FBGA (27x27)
Number of Logic Elements/Cells46080

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Packaging Process